We will exhibit at “IC & SENSOR PACKAGING EXPO” to be held in Tokyo, from January 24th to 26th, 2024.

Our improved wafer plating equipment with strong agitation and high current specifications, jet plating equipment, and other products that enable more efficient plating experiments than ever before will be exhibited. Please stop by and visit our booth.

From this year, paper invitations have been discontinued and full pre-registration is required. Please click on the invitation link below to register.

■Exhibition Outline

Date: Wednesday, January 24 – Friday, January 26, 2024
Place: Tokyo Big Sight, Japan
Booth No. : E31-34

■Invitation Link

https://www.nepconjapan.jp/tokyo/ja-jp/register.html?code=0907468067544321-BHX