We will exhibit our products at SURTECH 2024 Surface Technology Elements Exhibition from January 31 to February 2, 2024.

We will be exhibiting our improved wafer plating equipment with high agitation and high current specifications, jet plating equipment, and other products that enable more efficient plating experiments than ever before.

■Exhibition Outline

Date: Wednesday, January 31 – Friday, February 2, 2024
Location: Tokyo Big Sight, East Hall
Booth No.: 3Q-16

For registration and program details, please refer to the following link.

SURTECH2024 official website: https://www.surtech.jp/

We look forward to seeing you at the exhibition.