TRIAL AND SMALL-LOT PRODUCTION KIT
B-89-EP Various Type of Plating Solution
Base bath plating solution without additives for convenient experimentation. By adding any amount of additives, you can find the optimal amount of additives.
Product No. | Kind of Solution | Chemical Name | Concentration (g/L) | Volume |
---|---|---|---|---|
B-89-EP-Cu-01 | Copper sulfate bath ( Decorative bath ) | Copper sulfate pentahydrate | 200 | 1L |
Sulfuric acid | 50 | |||
Chloride ion ( Using hydrochloric acid ) | 0.05 | |||
B-89-EP-Cu-02 | Copper sulfate bath ( High-Throwing bath ) | Copper sulfate pentahydrate | 65 | 1L |
Sulfuric acid | 200 | |||
Chloride ion ( Using hydrochloric acid ) | 0.05 | |||
B-89-EP-Ni-01 | Watts bath ( Nickel sulfate bath ) | Nickel sulfate hexahydrate | 240 | 1L |
Nickel chloride hexahydrate | 45 | |||
Boric acid | 30 | |||
B-89-EP-Ni-02 | Nickel sulfamate bath | Nickel Sulfamate Tetrahydrate | 450 | 1L |
Nickel chloride hexahydrate | 15 | |||
Boric acid | 30 |
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