Double-sided Wafer Plating Equipment

A double-sided plating device on a wafer, especially suitable for TSV and TSG plating.
・Can be plated on square substrates of 2 to 8 inches or the same size.
・Stir both sides of the wafer with a paddle.
・Supports CE mark on request.

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Tapered Barrel “SHACHIHOKO-MINI”

Miniaturization for precious metal plating
A small version of the tapered barrel Shachihoko®. Realized compact size that fits in a 3L beaker.(*1) Plating in a smaller water tank than before is possible, reducing the burden of using expensive liquids such as precious metal plating liquids.

*1　Standard size is 5L beaker.

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Programmable Power Supply YPP15031WA（10μA〜3A）

A high-performance programmable power supply which equips estimation/calculation functions and 10μA of min. resolution. Supports Japanese, English, and Chinese.

Features

Functions: Power supply, thermostat, control by PC, plating experiment estimate, data collection and
analysis, expansion board slot.
For: 2-4 inch wafer, semiconductor, sensor, MEMS, fine barrel, etc.

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Programmable Power Supply YPP15100WA（1mA〜10A）

A high-performance programmable power supply which equips estimation/calculation functions and 1mA　of min. resolution. Supports Japanese, English, and Chinese.

Features

Functions: Power supply, thermostat, control by PC, plating experiment estimate, data collection and
analysis, expansion board slot.
For: 5-12 inch wafer, semiconductor, sensor, MEMS, fine barrel, etc.

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