WAFER PLATING
Double-sided Wafer Plating Equipment (A-52-STD)
A double-sided plating device on a wafer, especially suitable for TSV and TGV plating.
・Can be plated on square substrates of 2 to 8 inches or the same size.
・Stir both sides of the wafer with a paddle.
・Supports CE mark on request.
This product is a special order item. We will design and manufacture according to your request.
Set Example
Category | Product Name | Q’ty |
Tank | Double-sided plating water tank for wafers | 1 |
Cathode Jig | Cathode cartridge for double-sided plating (standard type / sealed type / suction type spy type) | 1 |
Anode Jig | Anode holder | 2 |
Heater | Heater (AC100V, 100,300,500W) | 1 |
Power Supply | Precision plating power supply for wafers (YPP15031WA/15100WA) | 1 |
AirPump | Air pump (for medium / 10L tank) | 1 |
Agitator | Paddle stirrer for double-sided plating (AC100V, 100-120V, 200-240V) | 1 |
Filter | Mini Mini Filter (20APFA / 40APFA) | 1 |
Lead Wire | 1 | |
Air filter | 1 |
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