WAFER PLATING
A-52-ST-EL WAFER ELECTROLESS PLATING EQUIPMENT
For conducting electroless plating on silicon wafers. Plating is possible from a single wafer to multiple wafers by vibrating the wafer(s) in vertical direction, while rotating them at the same time.
The rotating speed and the vertical vibration speed can be adjusted.
*Make-to-order product.
*For detail, please contact us.
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