Silicon Wafer Cathode Cartridge

Features

  • This jig is specially designed for plating laboratory equipment for silicon wafers, which is intended for wet plating.
  • It can be used for precision plating of semiconductors, MEMS, LIGA, etc.
  • Excellent uniformity of electrodeposition, with in-plane film thickness variation within ±3~5%.
  • Jigs for double-sided wafer plating are also available by special order.

Types of Jigs

Three types of cathode cartridges are available: standard, sealed, and suction-sealed.
Please select the one best suited for your wafer size and plating thickness.

TypeStandard typeSealed typeSuction and Sealed TypeHigh Current Type
Wafer Sizeφ2-12inch
10-300mm□
φ2-4inch
10-100mm□
φ4-12inch
100-300mm□
φ4-8inch
100-200mm□
Overview● Suitable for wafers of general thickness
● Plating is also deposited on the contacts
(convex parts) of the electrode ring
● Necessary to peel off the contact plating
film on a regular basis.
● Does not run around the contacts or the
back side of the wafer.
● Can also be used as a jig for anodizing.
● Thick plating film is possible.
● Does not run around the contacts or the back side of the wafer.
● Can also be used as a jig for anodizing.
● Suitable for thin wafers that are easily damaged. Sealing can be improved by sucking with air in combination with a vacuum evacuator.
● Thick plating film is possible.
● Suitable for wafers of general thickness.
● Possible to set higher current density
than usual such as high speed plating.
● Suitable for plating all surfaces and increasing the total current.
● Plating is also deposited on the contacts (surface contacts) of the electrode ring.
● Necessary to peel off the contact
plating film on a regular basis.
Wafer Thicknessfrom 200μmfrom 200μmfrom 100μmfrom 100μm
Plating Thicknessup to 20μmfrom 20μmfrom 20μmfrom 20μm
Heatproof Temp.0-65℃0-65℃0-80℃0-65℃

Notices

  • Wafer sizes are manufactured according to JEITA and SEMI standards.
  • Orifler and notched cathode cartridges are available.
  • Sealed and suction-sealed types are patented in Japan, USA, Europe, China, Korea, and Taiwan.

Custom-made

We custom manufacture jigs from one piece to fit your samples.
Please feel free to contact us for custom-made designs in the following cases.

  • Special shapes such as round, square, round-cut fan, semi-circular, etc.
  • When using samples with thicknesses other than JEITA and SEMI standards
  • When you want to process multiple samples with a single jig
  • When a jig for double-sided plating or a jig for flexible substrates is required

Related Products

  1. Silicon Wafer Cathode Cartridge(High current type)(A-52-STH*-P02A)

    Silicon Wafer Cathode Cartridge(High current type)(A-52-STH*-P02A)

  2. Smart Cell® (W) Silicon Wafer-use Set Assembly Example

    A set of plating tanks ideal for basic experiments such as chip and bump plating of silicon wafers. Stable current distribution is realized by using overflow circulation.

  3. Wafer Anode Plate

  4. PADDLE AGITATOR (A-52-ST-P04D)

    Paddle agitator device for plating and is sized for wafer tanks. Agitation in the vicinity of the sample improves the deposition uniformity of plating.

  5. SILICON WAFER PLATING TANK (A-52-ST-P01A)

  6. A-52-ST-EL WAFER ELECTROLESS PLATING EQUIPMENT

PRODUCT CATEGORY


  1. Plating Analyzer
    Titration Analyzers, Boume Hydrometer, Sulphameter,

  2. Plating Test Kit
    Hull Cell Test Kit,Jet Plating,Strain Gauge-Type Stress-Meter,Spiral Contract-Meter, Haring Cell

  3. Wafer Plating Kit
    Silicon Wafer Plating Kit

  4. Laboratory and Small-lot Production Kit
    Beaker-KUN, , 2L laboratory Tank set,

  5. Barrel
    Horizontal Barrel, Tapered Barrel, Micro Barrel,Dummy Ball

  6. Tank
    Materials vary and tank volume from 33ml to 200L

  7. Heater/Thermostat
    Small Heaters, immersion heater, L-type heater

  8. Filter and agitation
    Multi-Filter, Air pump, Air Filter, cartridge

  9. Power Supply
    Programmable Power Supply, Silicon Rectifier, Step-down Transformer

  10. Cathode Rocker
    Paddle Cathode Rocker 200BWA, forr Electroless Plating, Beaker plating

  11. Jig
    Clasp for heater, sensor, Crips for samples, Rack

  12. Anode/Cathhoode
    Size vary, Hole processing and cutting are available

  13. Brush Plating
    For repair of wear and scratches and Decorative plating (engraving, etc.)
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